Every story tagged Advanced Packaging, curated for CIOs and IT leaders — ranked by source credibility, engagement, and freshness.
1 story · open in the command center
Intel has appointed Lee Seok-hee, former SK Hynix CEO, as Senior Vice President of Intel Foundry to accelerate its AI and high-performance computing market strategy through advanced packaging and system integration capabilities. This strategic hire brings deep semiconductor manufacturing expertise and signals Intel's commitment to strengthening its foundry business by leveraging leadership experience in chip design, memory technology, and advanced packaging solutions. For IT organizations, this leadership move indicates Intel's competitive repositioning in the AI infrastructure market, potentially influencing processor and packaging technology roadmaps that impact data center and enterprise computing strategies.