Singapore’s Nexstrom wants to bring 2D semiconductors to chip fabs

Singapore-based Nexstrom is developing manufacturing equipment and processes to grow 2D semiconductor materials directly on 300mm wafers, aiming to help foundries overcome the scaling, power, and heat limits of silicon as AI and data center demand keeps pressure on chip supply. For CIOs and technology leaders, the strategic significance is long-term: if 2D materials reach production scale, they could enable more efficient, higher-density chips that improve performance-per-watt and reshape hardware roadmaps, but commercialization is still years away and dependent on major foundry adoption. IT organizations should view this as an early signal of the next semiconductor transition, with potential implications for future infrastructure procurement, supply chain resilience, and compute cost curves.