Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks (Bloomberg)

Samsung and TSMC’s commitment to ASML’s High NA EUV tools signals that the semiconductor industry is moving into the next major manufacturing transition, which should improve the ability to produce smaller, more powerful, and more energy-efficient chips that underpin AI, cloud, and advanced enterprise systems. For CIOs and technology leaders, the strategic takeaway is that leading-edge hardware supply, cost, and availability will be shaped by a smaller set of highly specialized suppliers, making long-term roadmaps, vendor risk management, and infrastructure planning even more critical for IT organizations.